Infineon Technologies AGCY7C1020DV33-10ZSXISRAM 芯片
SRAM Chip Async Single 3.3V 512K-bit 32K x 16 10ns 44-Pin TSOP-II Tray
| Compliant | |
| 3A991b.2.b. | |
| LTB | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| 512K | |
| 32K | |
| 16 | |
| SDR | |
| 15 | |
| 1 | |
| Asynchronous | |
| 10 | |
| 3 | |
| 3.3 | |
| 3.6 | |
| 60 | |
| -40 | |
| 85 | |
| Industrial | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1.04(Max) |
| Package Width | 10.26(Max) |
| Package Length | 18.52(Max) |
| PCB changed | 44 |
| Standard Package Name | SO |
| Supplier Package | TSOP-II |
| 44 | |
| Lead Shape | Gull-wing |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.

