Infineon Technologies AGCY62177EV30LL-55BAXISRAM 芯片
SRAM Chip Async Single 3V 32M-bit 2M x 16 55ns 48-Pin FBGA Tray
| Compliant | |
| 3A991b.2.a. | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| 32M | |
| 2M | |
| 16 | |
| SDR | |
| 21 | |
| 1 | |
| Asynchronous | |
| 55 | |
| 0.09um | |
| 2.2 | |
| 3 | |
| 3.7 | |
| 45 | |
| -40 | |
| 85 | |
| Industrial | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.91(Max) |
| Package Width | 8 |
| Package Length | 9.5 |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 48 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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