Samsung Electro-MechanicsCL32B226KAJNNNE多层陶瓷电容器
Cap Ceramic 22uF 25V X7R 10% Pad SMD 1210 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8541.21.00.95 | |
| Automotive | No |
| PPAP | No |
| 22uF | |
| 10% | |
| 25VDC | |
| Low | |
| X7R | |
| Standard | |
| Yes | |
| Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 10 | |
| 3.2 X 2.5 X 2.5 | |
| 1210 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 3.2 | |
| 2.5 | |
| 2.5 | |
| 0.1177 | |
| ±0.3 | |
| ±0.2 | |
| ±0.2 |
| EDA / CAD Models |
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