Samsung Electro-MechanicsCL21X106MOQNNNE多层陶瓷电容器
Cap Ceramic 10uF 16V X6S 20% Pad SMD 0805 105°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| COMPONENTS | |
| Automotive | No |
| PPAP | No |
| 10uF | |
| 20% | |
| 16VDC | |
| X6S | |
| Standard | |
| No | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 10 | |
| 2 X 1.25 X 1.25 | |
| 0805 | |
| -55 | |
| 105 | |
| Tape and Reel | |
| 2 | |
| 1.25 | |
| 1.25 |
| EDA / CAD Models |
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