Samsung Electro-MechanicsCL21B562JBANNNC多层陶瓷电容器
Cap Ceramic 0.0056uF 50V X7R 5% Pad SMD 0805 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8532.24.00.20 | |
| Automotive | No |
| PPAP | No |
| 0.0056uF | |
| 5% | |
| 50VDC | |
| X7R | |
| Standard | |
| No | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 2.5 | |
| 2 X 1.25 X 0.65 | |
| 0805 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 2 | |
| 1.25 | |
| 0.65 |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.