Samsung Electro-MechanicsCL21B102KDCNFNC多层陶瓷电容器
Cap Ceramic 0.001uF 200V X7R 10% Pad SMD 0805 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| COMPONENTS | |
| Automotive | No |
| PPAP | No |
| 0.001uF | |
| 10% | |
| 200VDC | |
| X7R | |
| Standard | |
| No | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 2.5 | |
| 2 X 1.25 X 0.85 | |
| 0805 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 2 | |
| 1.25 | |
| 0.85 | |
| 0.0133 |
| EDA / CAD Models |
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