Samsung Electro-MechanicsCL10A106MP8NNND多层陶瓷电容器
Cap Ceramic 10uF 10V X5R 20% Pad SMD 0603 85°C T/R
| Compliant | |
| EAR99 | |
| NRND | |
| 8532.24.00.20 | |
| Automotive | No |
| PPAP | No |
| 10uF | |
| 20% | |
| 10VDC | |
| X5R | |
| Standard | |
| No | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 10 | |
| 1.6 X 0.8 X 0.8 | |
| 0603 | |
| -55 | |
| 85 | |
| Tape and Reel | |
| 1.6 | |
| 0.8 | |
| 0.8 |
| EDA / CAD Models |
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