Samsung ElectronicsCL03A105MP3NSNC多层陶瓷电容器
Cap Ceramic 1uF 10V X5R 20% Pad SMD 0201 85°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| 1uF | |
| 20% | |
| 10VDC | |
| X5R | |
| Standard | |
| Yes | |
| Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 10 | |
| 0.6 X 0.3 X 0.3 | |
| 0201 | |
| -55 | |
| 85 | |
| Tape and Reel | |
| 0.6 | |
| 0.3 | |
| 0.3 | |
| 0.000317 | |
| ±0.05 | |
| ±0.05 | |
| ±0.05 |
| EDA / CAD Models |
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