Syfer Technology111126300271GQTAF9LM多层陶瓷电容器
Cap Ceramic 270pF 630V C0G 2% Pad SMD 1111 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8532.24.00.20 | |
| Automotive | No |
| PPAP | No |
| 270pF | |
| 2% | |
| 630VDC | |
| C0G | |
| Standard | |
| Yes | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 2.79 X 2.79 X 2 | |
| 1111 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 2.79 | |
| 2.79 | |
| 2 |
| EDA / CAD Models |
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