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CD74AC273M96|TI|simage
CD74AC273M96|TI|limage
Flip Flop

CD74AC273M96

Flip Flop D-Type Bus Interface Pos-Edge Push-Pull 1-Element 20-Pin SOIC T/R

Texas Instruments

Specifiche Tecniche del Prodotto
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8542.39.00.70
  • Automotive
    No
  • PPAP
    No
  • Logic Family
    AC
  • Logic Function
    D-Type Bus Interface
  • Number of Channels per Chip
    8
  • Number of Elements per Chip
    1
  • Number of Element Inputs
    8
  • Number of Element Outputs
    8
  • Bus Hold
    No
  • Set/Reset
    Master Reset
  • Polarity
    Non-Inverting
  • Triggering Type
    Positive-Edge
  • Maximum Propagation Delay Time @ Maximum CL (ns)
    169@1.5V|18.9@3.3V|13.5@5V
  • Absolute Propagation Delay Time (ns)
    169
  • Process Technology
    130nm
  • Input Signal Type
    Single-Ended
  • Output Type
    Push-Pull
  • Maximum Low Level Output Current (mA)
    24
  • Maximum High Level Output Current (mA)
    -24
  • Minimum Operating Supply Voltage (V)
    1.5
  • Typical Operating Supply Voltage (V)
    1.8|2.5|3.3|5
  • Maximum Operating Supply Voltage (V)
    5.5
  • Maximum Quiescent Current (mA)
    0.008
  • Propagation Delay Test Condition (pF)
    50
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    2.35(Max)
  • Package Width
    7.5
  • Package Length
    12.8
  • PCB changed
    20
  • Standard Package Name
    SO
  • Supplier Package
    SOIC
  • Pin Count
    20
  • Lead Shape
    Gull-wing

Documentazione e Risorse

Schede tecniche
Risorse di progettazione