Winbond ElectronicsW71NW20GD1DWMulti-Chip Package Memory
MCP 1.8V 2Gb NAND Flash and 1Gb DRAM
| Compliant | |
| NRND | |
| EA | |
| Automotive | No |
| PPAP | No |
| 2G | |
| 1G | |
| Yes | |
| 1.7 | |
| 1.95 | |
| -40 | |
| 85 | |
| Mounting | Surface Mount |
| Package Height | 1 |
| Package Width | 8 |
| Package Length | 9 |
| EDA / CAD Models |
Sistemas de drones más inteligentes
Equípese con potentes herramientas y estrategias inteligentes para diseñar los sistemas de drones ágiles, eficaces y modulares del futuro.