BournsSF-1206HI050M-2Fusibles
Fuse Chip Slow Blow Acting 0.5A 65V SMD Solder Pad 1206 Ceramic T/R
| Compliant | |
| EAR99 | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Slow Blow | |
| Battery Chargers|Battery Management Systems|Cell Phones | |
| 3.2 X 1.6 X 0.97 | |
| 0.5 | |
| 65 | |
| 65 | |
| 0.0354 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| 1.6 | |
| 3.2 | |
| 0.79 | |
| Ceramic | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
Contrarreste eficazmente amenazas de drones
Descubra cómo combinar procesamiento inteligente, detección avanzada y respuesta rápida en un sistema de defensa unificado contra los drones.