QUALCOMMSDA-845-A-914BMPSP-MT-02-0-AASOC y procesadores de la aplicación

Qualcomm® SDA845 Application Processor

The SDA845 SoC combines high-performance heterogeneous computing, Qualcomm® Artificial Intelligence (AI) Engine for on-device machine learning, computer vision, hardware-based security, multimedia, and Wi-Fi. A System-on-Chip (SoC) designed using next generation mobile technology with tech savvy consumers in mind.

SDA845 utilizes heterogenous compute capabilities to enable immersive multimedia experiences including eXtended reality (XR), on-device artificial intelligence (AI) and lightning-fast connectivity. The SDA845 also introduces a hardware isolated subsystem called the secure processing unit (SPU), which is designed to add vault-like characteristics to existing layers of Qualcomm Technologies’ security features.

The 3rd generation Qualcomm AI Engine enables on-device intelligence and simplifies how pictures and videos are taken. It also enables enhanced features like camera bokeh, more true to life XR, gaming, and long lasting battery life. The core hardware architectures are engineered to run AI applications quickly and efficiently.

Applications

• •  XR, VR, Gaming
• •  Artificial Intelligence
• •  Robotics, Drones
• •  Wearables
• •  Portable Healthcare
• •  Connected Cameras

Features and Benefits

• •  Customized 64-bit Arm v8-compliant octacore Qualcomm® Kryo™ 385 applications processor
• •  Always-on subsystem with RPMh for hardware-based resource and power management
• •  Qualcomm® Universal Bandwidth Compression (UBWC) 2.0, 2x compression with camera, display, and DSP
• •  Qualcomm Spectra™ 280 camera: dual 14-bit image signal processing (ISP) + Lite ISP: 16 + 16 + 2 megapixels (MP) to support 32MP/30 fps
• •  A complete 4K60 entertainment system 4K60 10b encode + 4K60 10b decode
• •  Audio DSP for low-power audio subsystem (LPASS)
• •  Compute DSP with Qualcomm® Hexagon™ Vector eXtensions (HVX)
• •  Low power sensor core helps support always-on use cases at reduced power levels
• •  Wi-Fi integrated 802.11ac 2x2 with MU-MIMO; Tri-band Wi-Fi: 2.4GHz and 5GHz with Dual Band Simultaneous (DBS), Bluetooth 5.0
• •  1x UFS 2.1, 2x USB 3.1, DisplayPort
• •  One 1-lane PCIe Gen 2 and one 1-lane PCIe Gen 3
• •  Secure processor

Related Products

SDA-845-A-914BMPSP-TR-02-0-AA
EIC-Q845-210

Chipsets

Product	Part Numbers
SDA845	SDA-845
Power Management Module*	PM-845 + PMI-8998 + PM-8005
Charger	SMB-1355
Connectivity	WCN-3990 or QCA-6335 or QCA-6310
Audio Codec (Analog)	WCD-9340 or WCD-9341
Audio Speaker	WSA-8810 or WSA-8815
Location	SDR-845

*Required

Please check part number accuracy before ordering.

Additional Notes

CPU	8x Kryo 385 CPU, up to 2.8 GHz
GPU	Qualcomm® Adreno™ 630 GPU with support for Open GL ES 3.2 and Open CL 2.0
Video	Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut; H.264 (AVC), H.265 (HEVC) and VP9 support; Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
Wireless Connectivity	Wi-Fi integrated 802.11ac 2x2 with MU-MIMO; Tri-band Wi-Fi: 2.4GHz and 5GHz with Dual Band Simultaneous (DBS), Bluetooth 5.0
Camera Performance	Single HFR 16 MPix camera @ 60fps ZSL, Dual 16 MPix cameras @ 30fps ZSL, Single 32 MPix camera at 30fps ZSL
Camera Interface	Three 4-lane CSI with C-PHY/D-PHY and one 2-lane CSI with D-PHY to support 4 + 4 + 4 + 2
Display Support	3840x2400 10bit 60fps + 4K60 DP 10bit or 4K30 Miracast
DSP	Hexagon 685 DSP with 3rd Gen Vector Extensions
Audio	Qualcomm Aqstic™ audio technology; Qualcomm® aptX™ audio technology
Location	GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
Memory & Storage	LPDDR4x, 4x16 bit; up to 1866MHz, 8GB RAM
Peripherals	1x 1-lane PCIe v2, 1x 1-lane PCIe v3, Qlink, 2xUSB3 (1x Type C with DP)
Package	10nm LPE/LPP, 12.4x12.4 MEP

Qualcomm SDA845, Qualcomm AI Engine, Qualcomm Adreno, Qualcomm Kryo, Qualcomm Universal Bandwidth Compression, Qualcomm Spectra, Qualcomm Hexagon, Qualcomm Aqstic and Qualcomm aptX are products of Qualcomm Technologies, Inc. and/or its subsidiaries.