| RoHS (Unión Europea) | Not Compliant |
| ECCN (Estados Unidos) | 3A001.a.2.c |
| Estatus de pieza | Active |
| Código HTS | 8542.31.00.30 |
| SVHC | Yes |
| Índice de SEP por encima del límite autorizado | Yes |
| Automotive | No |
| PPAP | No |
| Family Name | Hercules TMS570 |
| Instruction Set Architecture | RISC |
| Device Core | ARM Cortex R4F |
| Core Architecture | ARM |
| Maximum CPU Frequency (MHz) | 160 |
| Maximum Clock Rate (MHz) | 160 |
| Data Bus Width (bit) | 16|32 |
| Program Memory Type | Flash |
| Program Memory Size | 2MB |
| RAM Size | 160KB |
| Maximum Expanded Memory Size | 4MB |
| Programmability | Yes |
| Interface Type | CAN/LIN/SPI/UART |
| Number of I/Os | 115 |
| No. of Timers | 1 |
| PWM | 32 |
| Number of ADCs | 2 |
| ADC Channels | 24/24 |
| ADC Resolution (bit) | 12/12 |
| USART | 0 |
| UART | 2 |
| USB | 0 |
| SPI | 3 |
| I2C | 0 |
| I2S | 0 |
| CAN | 3 |
| Ethernet | 0 |
| Minimum Operating Supply Voltage (V) | 1.35 |
| Typical Operating Supply Voltage (V) | 1.5 |
| Maximum Operating Supply Voltage (V) | 1.65 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.95(Max) |
| Package Width | 16.1(Max) |
| Package Length | 16.1(Max) |
| PCB changed | 337 |
| Standard Package Name | BGA |
| Supplier Package | NFBGA |
| Pin Count | 337 |
| Lead Shape | Ball |
