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W9812G6KH5I|WINBOND|simage
W9812G6KH5I|WINBOND|limage
DRAM Chip

W9812G6KH-5I

DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II

Winbond Electronics
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.02
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    SDRAM
  • Chip Density (bit)
    128M
  • Organization
    8Mx16
  • Number of Internal Banks
    4
  • Number of Words per Bank
    2M
  • Number of Bits/Word (bit)
    16
  • Data Bus Width (bit)
    16
  • Maximum Clock Rate (MHz)
    200
  • Maximum Access Time (ns)
    4.5|6
  • Address Bus Width (bit)
    14
  • Interface Type
    LVTTL
  • Minimum Operating Supply Voltage (V)
    3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    80
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Number of I/O Lines (bit)
    16
  • Mounting
    Surface Mount
  • Package Height
    1
  • Package Width
    10.16
  • Package Length
    22.22
  • PCB changed
    54
  • Standard Package Name
    SO
  • Supplier Package
    TSOP-II
  • Pin Count
    54

Documentation and Resources

Datasheets
Design resources