DRAM Chip
W97BH6MBVA1E
DRAM Chip LPDDR2 SDRAM 2Gbit 128Mx16 1.2V/1.8V 134-Pin VFBGA
Winbond ElectronicsProduct Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8542.32.00.36
Automotive
No
PPAP
No
DRAM Type
LPDDR2 SDRAM
Chip Density (bit)
2G
Organization
128Mx16
Number of Internal Banks
8
Number of Words per Bank
16M
Number of Bits/Word (bit)
16
Data Bus Width (bit)
16
Maximum Clock Rate (MHz)
533
Maximum Access Time (ns)
5.5
Address Bus Width (bit)
17
Interface Type
HSUL_12
Minimum Operating Supply Voltage (V)
1.14|1.7
Maximum Operating Supply Voltage (V)
1.3|1.95
Operating Current (mA)
190
Minimum Operating Temperature (°C)
-25
Maximum Operating Temperature (°C)
85
Number of I/O Lines (bit)
16
Mounting
Surface Mount
Package Height
0.63(Max)
Package Width
10
Package Length
11.5
PCB changed
134
Standard Package Name
BGA
Supplier Package
VFBGA
Pin Count
134
Lead Shape
Ball