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W957A8MFYA5I|WINBOND|simage
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DRAM Chip

W957A8MFYA5I

DRAM Chip Mobile-DDR SDRAM 128Mbit 16Mx8 3V 24-Pin TFBGA

Winbond Electronics
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    LTB
  • HTS
    8542.32.00.02
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    Mobile-DDR SDRAM
  • Chip Density (bit)
    128M
  • Organization
    16Mx8
  • Number of Bits/Word (bit)
    8
  • Data Bus Width (bit)
    8
  • Maximum Clock Rate (MHz)
    200
  • Maximum Access Time (ns)
    35(Min)
  • Address Bus Width (bit)
    48
  • Interface Type
    HyperBus
  • Minimum Operating Supply Voltage (V)
    2.7
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    60
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Number of I/O Lines (bit)
    8
  • Mounting
    Surface Mount
  • Package Height
    0.85 mm
  • Package Width
    6 mm
  • Package Length
    8 mm
  • PCB changed
    24
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    24
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources