DRAM Chip

W949D6DBHX5I

DRAM Chip Mobile LPDDR SDRAM 512Mbit 32Mx16 1.8V 60-Pin VFBGA

Winbond Electronics

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR SDRAM

• Chip Density (bit)

  512M

• Organization

  32Mx16

• Number of Internal Banks

  4

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  200

• Maximum Access Time (ns)

  6.5|5

• Address Bus Width (bit)

  15

• Interface Type

  LVCMOS

• Minimum Operating Supply Voltage (V)

  1.7

• Maximum Operating Supply Voltage (V)

  1.95

• Operating Current (mA)

  75

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  0.66

• Package Width

  8

• Package Length

  9

• PCB changed

  60

• Standard Package Name

  BGA

• Supplier Package

  VFBGA

• Pin Count

  60

• Lead Shape

  Ball