DRAM 칩

W634GU6RB11I

DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin VFBGA T/R

Winbond Electronics

Product Technical Specifications

• 유럽 연합 RoHS 명령어

  Compliant

• 미국수출통제분류ECCN 인코딩

  EAR99

• 친환경 무연

  Active

• 미국 세관 상품 코드

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3L SDRAM

• Chip Density (bit)

  4G

• Organization

  256Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  32M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1866

• Maximum Access Time (ns)

  0.195

• Address Bus Width (bit)

  18

• Minimum Operating Supply Voltage (V)

  1.283

• Maximum Operating Supply Voltage (V)

  1.45

• Operating Current (mA)

  121

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Packaging

  Tape and Reel

• Mounting

  Surface Mount

• Package Height

  0.6(Max)

• Package Width

  7.5

• Package Length

  13

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  VFBGA

• Pin Count

  96