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W632GU6NB11|WINBOND|simage
W632GU6NB11|WINBOND|limage
DRAM Chip

W632GU6NB-11

DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V 96-Pin VFBGA

Winbond Electronics
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Obsolete
  • HTS
    8542.32.00.36
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    DDR3L SDRAM
  • Chip Density (bit)
    2G
  • Organization
    128Mx16
  • Number of Internal Banks
    8
  • Number of Words per Bank
    16M
  • Number of Bits/Word (bit)
    16
  • Data Bus Width (bit)
    16
  • Maximum Clock Rate (MHz)
    933
  • Maximum Access Time (ns)
    0.195
  • Address Bus Width (bit)
    17
  • Minimum Operating Supply Voltage (V)
    1.283
  • Maximum Operating Supply Voltage (V)
    1.45
  • Operating Current (mA)
    235
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    95
  • Supplier Temperature Grade
    Commercial
  • Number of I/O Lines (bit)
    16
  • Mounting
    Surface Mount
  • Package Height
    0.6(Max)
  • Package Width
    7.5
  • Package Length
    13
  • PCB changed
    96
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    96

Documentation and Resources

Datasheets
Design resources