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W631GG6NB12|WINBOND|simage
W631GG6NB12|WINBOND|limage
DRAM Chip

W631GG6NB-12

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin VFBGA

Winbond Electronics
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Obsolete
  • HTS
    8542.32.00.32
  • Automotive
    Yes
  • PPAP
    Unknown
  • DRAM Type
    DDR3 SDRAM
  • Chip Density (bit)
    1G
  • Organization
    64Mx16
  • Number of Internal Banks
    8
  • Number of Words per Bank
    8M
  • Number of Bits/Word (bit)
    16
  • Data Bus Width (bit)
    16
  • Maximum Clock Rate (MHz)
    1600
  • Maximum Access Time (ns)
    0.225
  • Address Bus Width (bit)
    16
  • Interface Type
    SSTL_15
  • Minimum Operating Supply Voltage (V)
    1.425
  • Maximum Operating Supply Voltage (V)
    1.575
  • Operating Current (mA)
    175
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    95
  • Supplier Temperature Grade
    Commercial
  • Number of I/O Lines (bit)
    16
  • Mounting
    Surface Mount
  • Package Height
    0.6(Max)
  • Package Width
    7.5
  • Package Length
    13
  • PCB changed
    96
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    96

Documentation and Resources

Datasheets
Design resources