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W29N08GVSIAF|WINBOND|simage
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Flash

W29N08GVSIAF

SLC NAND Flash Serial 3.3V 8G-bit 8M x 8 Automotive AEC-Q100 48-Pin TSOP-I

Winbond Electronics
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Part Status
    Obsolete
  • HTS
    8542.32.00.71
  • Automotive
    Yes
  • PPAP
    Unknown
  • Cell Type
    SLC NAND
  • Chip Density (bit)
    8G
  • Architecture
    Sectored
  • Boot Block
    No
  • Address Width (bit)
    29
  • Number of Bits/Word (bit)
    8
  • Number of Words
    8M
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Maximum Erase Time (s)
    0.01/Block
  • Maximum Programming Time (ms)
    0.7
  • Interface Type
    Serial
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.7 to 3.6
  • Program Current (mA)
    25
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    No
  • ECC Support
    Yes
  • Support of Page Mode
    No
  • Mounting
    Surface Mount
  • Package Height
    1
  • Package Width
    18.4
  • Package Length
    12
  • PCB changed
    48
  • Standard Package Name
    SO
  • Supplier Package
    TSOP-I
  • Pin Count
    48

Documentation and Resources

Datasheets
Design resources