Flash

W29N02GVSIAA

SLC NAND Flash Parallel 3V/3.3V 2G-bit 256M x 8 25ns 48-Pin TSOP-I Automotive AEC-Q100

Winbond Electronics

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  COMPONENTS

• Automotive

  Yes

• PPAP

  Unknown

• Cell Type

  SLC NAND

• Chip Density (bit)

  2G

• Architecture

  Sectored

• Boot Block

  No

• Block Organization

  Symmetrical

• Address Width (bit)

  29

• Sector Size

  128Kbyte x 2048

• Page Size

  2Kbyte

• Number of Bits/Word (bit)

  8

• Number of Words

  256M

• Programmability

  Yes

• Timing Type

  Asynchronous

• Max. Access Time (ns)

  25

• Maximum Erase Time (s)

  0.01/Block

• Maximum Programming Time (ms)

  0.7/Page

• Interface Type

  Parallel

• Minimum Operating Supply Voltage (V)

  2.7

• Typical Operating Supply Voltage (V)

  3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  35

• Program Current (mA)

  35

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  No

• ECC Support

  Yes

• Support of Page Mode

  Yes

• Minimum Endurance (Cycles)

  100000

• Mounting

  Surface Mount

• Package Height

  1 mm

• Package Width

  18.4 mm

• Package Length

  12 mm

• PCB changed

  48

• Standard Package Name

  SO

• Supplier Package

  TSOP-I

• Pin Count

  48

• Lead Shape

  Gull-wing