Flash

W25Q16JVSNIQ TR

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 16M-bit 2M x 8 6ns 8-Pin SOIC N T/R

Winbond Electronics

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  LTB

• HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  16M

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Location of Boot Block

  Bottom|Top

• Address Width (bit)

  24

• Sector Size

  4Kbyte x 512

• Page Size

  256byte

• Number of Bits/Word (bit)

  8

• Number of Words

  2M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  6

• Maximum Erase Time (s)

  25/Chip

• Maximum Programming Time (ms)

  3/Page

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Minimum Operating Supply Voltage (V)

  2.7

• Typical Operating Supply Voltage (V)

  3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  25

• Program Current (mA)

  25

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Mounting

  Surface Mount

• Package Height

  1.45

• Package Width

  3.9

• Package Length

  4.85

• PCB changed

  8

• Standard Package Name

  SO

• Supplier Package

  SOIC N

• Pin Count

  8