Flash

W25N512GVEIG

SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3.3V 512M-bit 8-Pin WSON EP Tray

Winbond Electronics

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  SLC NAND

• Chip Density (bit)

  512M

• Architecture

  Sectored

• Boot Block

  No

• Address Width (bit)

  15

• Programmability

  Yes

• Timing Type

  Synchronous

• Maximum Erase Time (s)

  0.01/Block

• Maximum Programming Time (ms)

  0.7

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Minimum Operating Supply Voltage (V)

  2.7

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Program Current (mA)

  35

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  No

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.73

• Package Width

  8

• Package Length

  6

• PCB changed

  8

• Standard Package Name

  SON

• Supplier Package

  WSON EP

• Pin Count

  8