Flash
W25N04KVZEIR
NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 4G-bit 512M x 8 7ns 8-Pin WSON EP Tray
Winbond ElectronicsProduct Technical Specifications
EU RoHS
Compliant
ECCN (US)
3A991.b.1.a
Part Status
Active
HTS
8542.32.00.71
Automotive
Unknown
PPAP
Unknown
Cell Type
NAND
Chip Density (bit)
4G
Architecture
Sectored
Boot Block
No
Block Organization
Symmetrical
Address Width (bit)
32
Sector Size
128Kbyte x 4096
Page Size
2Kbyte
Number of Bits/Word (bit)
8
Number of Words
512M
Timing Type
Synchronous
Max. Access Time (ns)
7
Maximum Erase Time (s)
0.01/Block
Maximum Programming Time (ms)
0.7/Page
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V)
2.7
Typical Operating Supply Voltage (V)
3.3|3
Maximum Operating Supply Voltage (V)
3.6
Programming Voltage (V)
2.7 to 3.6
Operating Current (mA)
35
Program Current (mA)
35
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Command Compatible
Yes
ECC Support
Yes
Support of Page Mode
Yes
Packaging
Tray
Mounting
Surface Mount
Package Height
0.73
Package Width
8
Package Length
6
PCB changed
8
Supplier Package
WSON EP
Pin Count
8