W25N02JWZEIF | High Performance QspiNAND Flash
High Performance QspiNAND enables a data transfer rate up to 166MB/s dual-quad in a single package and it accelerates cluster boot-up time. | SLC NAND Flash Serial-SPI 1.8V 2G-bit 16-Pin SOIC W Tray
Winbond ElectronicsThe new W25N / W72N is a single-level cell (SLC) QspiNAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC).
Winbond new High Performance QspiNAND enables a data transfer rate four times faster than Parallel NAND and other QspiNAND currently on the market. Transferring data at 83MB/s, which far exceeds competing NAND flash on the market, Winbond's new solution accelerates instrument cluster boot-up time.
It also supports dual-quad I/O interface to accommodate higher storage density or data transfer rate up to 166 MB/s. The selection allowing for single, dual and quad I/O means customers can enjoy more flexibility compared to what competitors can offer. Furthermore, Winbond this new High Performance QspiNAND supports hardware reset pin which is more convenient for hardware / software design for automotive applications.
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Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
3A991b.1.a.
Part Status
Active
HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
NAND
Chip Density (bit)
2G
Boot Block
No
Address Width (bit)
32
Page Size
2Kbyte
Number of Bits/Word (bit)
8
Number of Words
256M
Programmability
Yes
Timing Type
Synchronous
Max. Access Time (ns)
6
Maximum Erase Time (s)
0.01/Block
Maximum Programming Time (ms)
0.7
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V)
1.7
Typical Operating Supply Voltage (V)
1.8
Maximum Operating Supply Voltage (V)
1.95
Programming Voltage (V)
1.7 to 1.95
Operating Current (mA)
35
Program Current (mA)
35
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Command Compatible
Yes
ECC Support
No
Support of Page Mode
No
Mounting
Surface Mount
Package Height
0.73
Package Width
8
Package Length
6
PCB changed
8
Standard Package Name
SON
Supplier Package
WSON EP
Pin Count
8