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Flash

W25N01GVTBIG

SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 24-Pin TFBGA Tray

Winbond Electronics

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  SLC NAND

• Chip Density (bit)

  1G

• Architecture

  Sectored

• Boot Block

  No

• Block Organization

  Symmetrical

• Address Width (bit)

  32

• Sector Size

  128Kbyte x 1024

• Page Size

  2Kbyte

• Number of Bits/Word (bit)

  8

• Number of Words

  128M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  7

• Maximum Erase Time (s)

  0.01/Block

• Maximum Programming Time (ms)

  0.7/Page

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Minimum Operating Supply Voltage (V)

  2.7

• Maximum Operating Frequency (MHz)

  104

• Typical Operating Supply Voltage (V)

  3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  35

• Program Current (mA)

  35

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  Yes

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.85

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  24