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SXPCEAC2HMCSP|SILEX|simage
SXPCEAC2HMCSP|SILEX|limage
Combo Wireless Modules

SX-PCEAC2-HMC-SP

Dual Band 802.11ac WLAN Plus BT Combo Module

Silex Technology America
Datasheets 

The Silex Technology America Combo wireless Modules is a dual based module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughout reaching upto 867 Mbps. It is powered by Qualcomm Atheros radio chip. The combo wireless modules has an operating temperature range of 0°C to +70°C. It has 3.3V of operating supply voltage and serial interface type.

Features and Benefits:
• Multiple Form Factors for Diverse Needs
• Enterprise Security Support
• Support from Design to Manufacture
• Modular Certifications.

Product Technical Specifications
  • EU RoHS
    Supplier Unconfirmed
  • ECCN (US)
    5A992c.
  • Part Status
    Active
  • HTS
    8517.62.00.90
  • Automotive
    No
  • PPAP
    No
  • Construction
    WLAN+BT
  • Style
    Module
  • BT Interface
    USB
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    70
  • BT Protocol Supported
    Bluetooth v5.0(BLE) + BR + EDR
  • WLAN Technology
    IEEE 802.11a/b/g/n/ac
  • Mounting
    Screw
  • Package Height
    3.4
  • Package Width
    26.8
  • Package Length
    30
Order Quantity

Documentation and Resources

Datasheets
Design resources