Microcontrollers - MCUs

SPC5775EDK3MME3

MCU 32-bit e200z7 RISC 4MB Flash 5V Automotive 416-Pin MAP-BGA Tray

NXP Semiconductors

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  5A992c.

• Part Status

  Active

• HTS

  8542.31.00.25

• SVHC

  Yes

• Automotive

  Yes

• PPAP

  Yes

• Family Name

  MPC57xx

• Instruction Set Architecture

  RISC

• Device Core

  e200z7

• Core Architecture

  e200

• Maximum CPU Frequency (MHz)

  264

• Maximum Clock Rate (MHz)

  264

• Data Bus Width (bit)

  32

• Program Memory Type

  Flash

• Program Memory Size

  4MB

• RAM Size

  512KB

• Programmability

  Yes

• Interface Type

  CAN/SPI

• Number of I/Os

  293

• Number of ADCs

  2

• ADC Channels

  40

• ADC Resolution (bit)

  16/16

• USART

  0

• UART

  0

• USB

  0

• SPI

  5

• I2C

  0

• I2S

  0

• CAN

  6

• Ethernet

  0

• Special Features

  CAN Controller

• Minimum Operating Supply Voltage (V)

  4.5

• Typical Operating Supply Voltage (V)

  5

• Maximum Operating Supply Voltage (V)

  5.5

• Maximum Power Dissipation (mW)

  1600

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.45(Max)

• Package Width

  27

• Package Length

  27

• PCB changed

  416

• Standard Package Name

  BGA

• Supplier Package

  MAP-BGA

• Pin Count

  416