Arrow Electronic Components Online
SPC5566MZP80|NXP|simage
SPC5566MZP80|NXP|limage
Microcontrollers - MCUs

SPC5566MZP80

MCU 32-bit e200z6 RISC 3MB Flash 1.8V/2.5V/3.3V/5V Automotive AEC-Q100 416-Pin BGA Tray

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Not Compliant
  • ECCN (US)
    3A991a.2.
  • Part Status
    Active
  • HTS
    8542.31.00.25
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    Yes
  • PPAP
    Yes
  • Family Name
    MPC55xx
  • Instruction Set Architecture
    RISC
  • Device Core
    e200z6
  • Core Architecture
    e200
  • Maximum CPU Frequency (MHz)
    80
  • Maximum Clock Rate (MHz)
    80
  • Data Bus Width (bit)
    32
  • Program Memory Type
    Flash
  • Program Memory Size
    3MB
  • RAM Size
    128KB
  • Programmability
    Yes
  • Interface Type
    CAN/SCI/SPI
  • Number of I/Os
    256
  • No. of Timers
    1
  • PWM
    1
  • Number of ADCs
    1
  • ADC Channels
    40
  • ADC Resolution (bit)
    12
  • USART
    0
  • UART
    0
  • USB
    0
  • SPI
    4
  • I2C
    0
  • I2S
    0
  • CAN
    4
  • Ethernet
    0
  • Minimum Operating Supply Voltage (V)
    1.35|1.62|3|4.5
  • Typical Operating Supply Voltage (V)
    5|3.3|2.5|1.8
  • Maximum Operating Supply Voltage (V)
    1.65|5.25|3.6
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    125
  • Supplier Temperature Grade
    Automotive
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.95(Max)
  • Package Width
    27
  • Package Length
    27
  • PCB changed
    416
  • Standard Package Name
    BGA
  • Supplier Package
    BGA
  • Pin Count
    416
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources