FIFOs Memory

SN74V293PZAEP

FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 18/128K x 9 80-Pin LQFP Tray

Texas Instruments

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  COMPONENTS

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  1.125M

• Organization

  64Kx18|128Kx9

• Configuration

  Dual

• Data Bus Width (bit)

  18/9

• Bus Directional

  Uni-Directional

• Timing Type

  Synchronous

• Maximum Clock Rate (MHz)

  133

• Max. Access Time (ns)

  5

• Process Technology

  180nm

• Minimum Operating Supply Voltage (V)

  3.15

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.45

• Operating Current (mA)

  35

• Minimum Operating Temperature (°C)

  -55

• Maximum Operating Temperature (°C)

  125

• Supplier Temperature Grade

  Extended

• Expansion Support

  Yes

• Expansion Type

  Depth|Width

• FWFT Support

  Yes

• Retransmit Capability

  Yes

• Packaging

  Tray

• Programmability

  Yes

• Mounting

  Surface Mount

• Package Height

  1.45(Max) mm

• Package Width

  14.2(Max) mm

• Package Length

  14.2(Max) mm

• PCB changed

  80

• Standard Package Name

  QFP

• Supplier Package

  LQFP

• Pin Count

  80

• Lead Shape

  Gull-wing