FIFOs Memory

SN74V215-20PAG

FIFO Mem Sync Dual Depth/Width Uni-Dir 512 x 18 64-Pin TQFP Tray

Texas Instruments

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  COMPONENTS

• SVHC

  Yes

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  9K

• Organization

  512x18

• Configuration

  Dual

• Data Bus Width (bit)

  18

• Bus Directional

  Uni-Directional

• Timing Type

  Synchronous

• Maximum Clock Rate (MHz)

  50

• Max. Access Time (ns)

  12

• Minimum Operating Supply Voltage (V)

  3

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  35

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  70

• Supplier Temperature Grade

  Commercial

• Expansion Support

  Yes

• Expansion Type

  Width|Depth

• FWFT Support

  Yes

• Retransmit Capability

  No

• Packaging

  Tray

• Programmability

  Yes

• Mounting

  Surface Mount

• Package Height

  1.05(Max)

• Package Width

  10.2(Max)

• Package Length

  10.2(Max)

• PCB changed

  64

• Standard Package Name

  QFP

• Supplier Package

  TQFP

• Pin Count

  64

• Lead Shape

  Gull-wing