Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8541.29.00.55
Automotive
No
PPAP
No
Category
Power MOSFET
Configuration
Dual
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
2
Maximum Drain-Source Voltage (V)
30
Maximum Gate-Source Voltage (V)
±20
Maximum Gate Threshold Voltage (V)
2.2
Operating Junction Temperature (°C)
-55 to 150
Maximum Continuous Drain Current (A)
3.7
Maximum Gate-Source Leakage Current (nA)
100
Maximum IDSS (uA)
1
Maximum Drain-Source Resistance (mOhm)
58@10V
Typical Gate Charge @ Vgs (nC)
1.8@4.5V|3.7@10V
Typical Gate Charge @ 10V (nC)
3.7
Typical Gate to Drain Charge (nC)
0.42
Typical Gate to Source Charge (nC)
0.74
Typical Reverse Recovery Charge (nC)
4
Typical Input Capacitance @ Vds (pF)
235@15V
Typical Reverse Transfer Capacitance @ Vds (pF)
16@15V
Minimum Gate Threshold Voltage (V)
1.2
Typical Output Capacitance (pF)
45
Maximum Power Dissipation (mW)
1140
Typical Fall Time (ns)
10
Typical Rise Time (ns)
15
Typical Turn-Off Delay Time (ns)
10
Typical Turn-On Delay Time (ns)
10
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Packaging
Tape and Reel
Typical Drain-Source Resistance @ 25°C (mOhm)
47@10V|58@4.5V
Maximum Power Dissipation on PCB @ TC=25°C (W)
1.14
Maximum Pulsed Drain Current @ TC=25°C (A)
15
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
150
Typical Diode Forward Voltage (V)
0.85
Typical Gate Plateau Voltage (V)
2.9
Typical Reverse Recovery Time (ns)
10
Maximum Diode Forward Voltage (V)
1.2
Minimum Gate Resistance (Ohm)
1
Maximum Gate Resistance (Ohm)
10
Maximum Positive Gate-Source Voltage (V)
20
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
3.4
Mounting
Surface Mount
Package Height
1(Max)
Package Width
1.65
Package Length
3.05
PCB changed
6
Standard Package Name
SO
Supplier Package
TSOP
Pin Count
6
Lead Shape
Gull-wing