Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
COMPONENTS
Automotive
No
PPAP
No
Category
Power MOSFET
Configuration
Single
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
1
Maximum Drain-Source Voltage (V)
8
Maximum Gate-Source Voltage (V)
±5
Maximum Gate Threshold Voltage (V)
0.8
Operating Junction Temperature (°C)
-55 to 150
Maximum Continuous Drain Current (A)
6
Maximum Gate-Source Leakage Current (nA)
100
Maximum IDSS (uA)
1
Maximum Drain-Source Resistance (mOhm)
17@4.5V
Typical Gate Charge @ Vgs (nC)
6@2.5V|10.5@4.5V
Typical Gate to Drain Charge (nC)
1
Typical Gate to Source Charge (nC)
1.6
Typical Reverse Recovery Charge (nC)
17
Typical Input Capacitance @ Vds (pF)
1070@4V
Typical Reverse Transfer Capacitance @ Vds (pF)
200@4V
Minimum Gate Threshold Voltage (V)
0.35
Typical Output Capacitance (pF)
385
Maximum Power Dissipation (mW)
1300
Typical Fall Time (ns)
25
Typical Rise Time (ns)
14
Typical Turn-Off Delay Time (ns)
65
Typical Turn-On Delay Time (ns)
6
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Packaging
Tape and Reel
Typical Drain-Source Resistance @ 25°C (mOhm)
14@4.5V|16@2.5V|18@1.8V|20@1.5V|25@1.2V
Maximum Power Dissipation on PCB @ TC=25°C (W)
1.3
Maximum Pulsed Drain Current @ TC=25°C (A)
30
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
166
Typical Diode Forward Voltage (V)
0.82
Typical Gate Plateau Voltage (V)
1
Typical Reverse Recovery Time (ns)
40
Maximum Diode Forward Voltage (V)
1.2
Minimum Gate Resistance (Ohm)
2.4
Maximum Gate Resistance (Ohm)
24
Maximum Positive Gate-Source Voltage (V)
5
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
6
Mounting
Surface Mount
Package Height
1.02(Max)
Package Width
1.4(Max)
Package Length
3.04(Max)
PCB changed
3
Standard Package Name
SOT
Supplier Package
SOT-23
Pin Count
3
Lead Shape
Gull-wing
Order Quantity