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SF2410HI250T2|BOURNS|simage
SF2410HI250T2|BOURNS|limage
Fuses

SF-2410HI250T-2

Fuse Chip 2.5A 125V SMD Solder Pad 2410 Ceramic T/R cUL

Bourns
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8536.10.00.40
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Application
    Battery Protection|LCD Backlight Inverter|LCD Monitor|Notebook|PC Server|POE|POE+|Power Supply|White Goods
  • Fuse Size (mm)
    6.1 X 2.6
  • Current Rating (A)
    2.5
  • Maximum Voltage Rating (V)
    125
  • Maximum AC Voltage Rating (V)
    125
  • Breaking Capacity @ Rated Voltage (A)
    50@125VAC|50@125VDC|300@32VDC
  • Typical Melting I2t (A²S)
    16.771
  • Typical Cold Resistance (Ohm)
    0.0317
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    2.6
  • Product Length (mm)
    6.1
  • Product Height (mm)
    2.6
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    2410
Order Quantity

Documentation and Resources

Datasheets
Design resources