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SF1206S160W2|BOURNS|simage
SF1206S160W2|BOURNS|limage
Fuses

SF-1206S160W-2

Fuse Chip Slow Blow Acting 1.6A 65V SMD Solder Pad 1206 3.2 X 1.6 X 1.08mm Copper T/R

Bourns
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8536.10.00.40
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Slow Blow
  • Application
    Backlight Driver|DC-DC Converter|Industrial Controller|LCD Monitor|Low Voltage Lighting Power|Notebook|Set Top Box
  • Fuse Size (mm)
    3.2 X 1.6 X 1.08
  • Current Rating (A)
    1.6
  • Maximum Voltage Rating (V)
    65
  • Maximum DC Voltage Rating (V)
    65
  • Breaking Capacity @ Rated Voltage (A)
    50@65VDC
  • Typical Melting I2t (A²S)
    0.525
  • Typical Cold Resistance (Ohm)
    0.0428
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.6
  • Product Length (mm)
    3.2
  • Product Height (mm)
    1.08
  • Fuse Material
    Copper
  • Mounting
    Surface Mount
  • Package/Case
    1206

Documentation and Resources

Datasheets
Design resources