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SF1206HV12M2|BOURNS|simage
SF1206HV12M2|BOURNS|limage
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Fuses

SF-1206HV12M-2

Fuse Chip 12A 35V SMD Solder Pad 1206 Ceramic T/R

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Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8536.10.00.40
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Application
    Battery Charger, Cell Phone, Digital Camera, Disk Drive, Industrial Controller
  • Fuse Size (mm)
    3.2 X 1.6 X 0.97
  • Current Rating (A)
    12
  • Maximum Voltage Rating (V)
    35
  • Maximum DC Voltage Rating (V)
    35
  • Breaking Capacity @ Rated Voltage (A)
    150@35VDC
  • Typical Melting I2t (A²S)
    20
  • Typical Cold Resistance (Ohm)
    0.0045
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.6
  • Product Length (mm)
    3.2
  • Product Height (mm)
    0.97
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    1206
  • Family/Series
    SF-1206HV
  • ROHS Version
    2011/65/EU
Order Quantity

Documentation and Resources

Datasheets
Design resources