Arrow Electronic Components Online
SF1206FP2002|BOURNS|simage
SF1206FP2002|BOURNS|limage
Fuses

SF-1206FP200-2

Fuse Chip Fast Acting 2A 63V SMD Solder Pad 1206 Ceramic T/R

Bourns
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    EA
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Fast
  • Application
    DVD|Digital Camera|Disk Drive|Industrial Controller|Battery Charger|Cell Phone
  • Fuse Size (mm)
    3.1 X 1.55 X 0.6
  • Current Rating (A)
    2
  • Maximum Voltage Rating (V)
    63
  • Maximum DC Voltage Rating (V)
    63
  • Breaking Capacity @ Rated Voltage (A)
    50@63VDC
  • Typical Melting I2t (A²S)
    0.285
  • Typical Cold Resistance (Ohm)
    0.285
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -20
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.55
  • Product Length (mm)
    3.1
  • Product Height (mm)
    0.6
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    1206

Documentation and Resources

Datasheets
Design resources