Flash

SDINBDA6-256G-ZA

NAND Flash Serial e-MMC 2T-bit Automotive AEC-Q100 153-Pin FBGA Tray

Western Digital

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active-Unconfirmed

• HTS

  8542.32.00.71

• Automotive

  Yes

• PPAP

  Yes

• Cell Type

  NAND

• Chip Density (bit)

  2T

• Boot Block

  No

• Programmability

  Yes

• Timing Type

  Synchronous

• Interface Type

  Serial e-MMC

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  No

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.2

• Package Width

  11.5

• Package Length

  13

• PCB changed

  153

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  153