Flash

S29GL128P90FFCR20

NOR Flash Parallel 3.3V 128M-bit 16M x 8/8M x 16 90ns 64-Pin Fortified BGA Tray

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Obsolete

• HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  128M

• Architecture

  Sectored

• Boot Block

  No

• Block Organization

  Symmetrical

• Address Width (bit)

  24/23

• Sector Size

  128Kbyte x 128

• Page Size

  8Words/16byte

• Number of Bits/Word (bit)

  8/16

• Number of Words

  16M/8M

• Programmability

  Yes

• Timing Type

  Asynchronous

• Max. Access Time (ns)

  90

• Maximum Erase Time (s)

  256/Chip

• Maximum Page Access Time (ns)

  25

• Maximum Programming Time (ms)

  123000(Typ)/Chip

• OE Access Time (ns)

  25

• Process Technology

  90nm

• Interface Type

  Parallel

• Minimum Operating Supply Voltage (V)

  3

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  3 to 3.6

• Operating Current (mA)

  110

• Page Read Current (mA)

  20

• Program Current (mA)

  90

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Commercial

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  Yes

• Minimum Endurance (Cycles)

  100000(Typ)

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.6(Min) mm

• Package Width

  11 mm

• Package Length

  13 mm

• PCB changed

  64

• Standard Package Name

  BGA

• Supplier Package

  Fortified BGA

• Pin Count

  64

• Lead Shape

  Ball