Flash

S29AL016J70BFI022

NOR Flash Parallel 3V/3.3V 16M-bit 2M x 8/1M x 16 70ns 48-Pin FBGA T/R

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  LTB

• HTS

  8542.32.00.51

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  16M

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Asymmetrical

• Location of Boot Block

  Bottom

• Address Width (bit)

  21/20

• Sector Size

  8Kbyte x 2|16Kbyte x 1|32Kbyte x 1|64Kbyte x 31

• Number of Bits/Word (bit)

  8/16

• Number of Words

  2M/1M

• Programmability

  Yes

• Timing Type

  Asynchronous

• Max. Access Time (ns)

  70

• Maximum Erase Time (s)

  10/Sector

• Maximum Programming Time (ms)

  160000/Chip

• OE Access Time (ns)

  30

• Process Technology

  110nm

• Interface Type

  Parallel

• Minimum Operating Supply Voltage (V)

  2.7

• Typical Operating Supply Voltage (V)

  3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  12

• Program Current (mA)

  30

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tape and Reel

• Mounting

  Surface Mount

• Package Height

  1(Max) - 0.18(Min) mm

• Package Width

  6.15 mm

• Package Length

  8.15 mm

• PCB changed

  48

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  48

• Lead Shape

  Ball