DRAM Chip

S27KL0641DABHA020

DRAM Chip DDR SDRAM 64Mbit 8Mx8 3V/3.3V 24-Pin Fortified BGA Tray Automotive AEC-Q100

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Obsolete

• HTS

  8542.32.00.02

• Automotive

  Yes

• PPAP

  Yes

• DRAM Type

  DDR SDRAM

• Chip Density (bit)

  64M

• Organization

  8Mx8

• Number of Bits/Word (bit)

  8

• Data Bus Width (bit)

  8

• Maximum Clock Rate (MHz)

  100

• Maximum Access Time (ns)

  40(Min)

• Process Technology

  63nm

• Minimum Operating Supply Voltage (V)

  2.7

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  60

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Automotive

• Number of I/O Lines (bit)

  8

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1(Max) - 0.2(Min)

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  Fortified BGA

• Pin Count

  24

• Lead Shape

  Ball