Flash

S26HS01GTGABHI030

NOR Flash Serial-SPI 1.8V 1G-bit 1G x 1 8ns 24-Pin BGA Tray

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991.b.1.a

• Part Status

  Active

• HTS

  8542.32.00.71

• Cell Type

  NOR

• Chip Density (bit)

  1G

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Location of Boot Block

  Bottom|Top

• Address Width (bit)

  32

• Sector Size

  256Kbyte x 512

• Page Size

  256byte|512byte

• Number of Bits/Word (bit)

  1

• Number of Words

  1G

• Timing Type

  Synchronous

• Max. Access Time (ns)

  8

• Maximum Erase Time (s)

  1381/Chip

• Maximum Programming Time (ms)

  1.7/Page

• Interface Type

  Serial-SPI

• Minimum Operating Supply Voltage (V)

  1.7

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  2

• Programming Voltage (V)

  1.7 to 2

• Operating Current (mA)

  198

• Program Current (mA)

  66

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  No

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1(Max) - 0.2(Min)

• Package Width

  8

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  BGA

• Pin Count

  24