Flash

S25FL256LDPBHB020

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 8ns 24-Pin BGA Tray Automotive AEC-Q100

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  Yes

• PPAP

  Yes

• Cell Type

  NOR

• Chip Density (bit)

  256M

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Location of Boot Block

  Bottom|Top

• Address Width (bit)

  32

• Sector Size

  4Kbyte x 8192

• Page Size

  256byte

• Number of Bits/Word (bit)

  1/2/4

• Number of Words

  256M/128M/64M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  8

• Maximum Erase Time (s)

  360/Chip

• Maximum Programming Time (ms)

  1.2/Page

• Process Technology

  65nm

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Minimum Operating Supply Voltage (V)

  2.7

• Maximum Operating Frequency (MHz)

  133

• Typical Operating Supply Voltage (V)

  3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  35

• Program Current (mA)

  50

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.2(Max) - 0.2(Min)

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  BGA

• Pin Count

  24

• Lead Shape

  Ball