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RB3G2COREKIT|THUNDERC|simage
RB3G2COREKIT|THUNDERC|limage
Embedded System Development Boards and Kits

RB3G2 CORE KIT

Qualcomm® RB3 Gen 2 development kit

ThunderComm
Datasheets 

Qualcomm® RB3 Gen 2 Core Kit

After a big success, Qualcomm® RB3 development kit now has a major upgrade. Powered by Qualcomm® QCS6490 Chipset, the Qualcomm® RB3 Gen 2 development kit is the latest IoT development kit in the line. Compared to RB3, the performance of Gen 2 kit has been improved greatly.

  • •  Powered by the Qualcomm® QCS6490 processor.
  • •  RB3 Gen 2 features support for Qualcomm® Linux®—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms.
  • •  Increased AI processing capabilities compared to previous generations.
  • •  Supports multiple SDKs and tools, including Qualcomm® Neural Processing SDK for AI, Qualcomm® Intelligent Multimedia Product SDK, Qualcomm® Intelligent Robotics Product SDK, Qualcomm® Hexagon™ DSP SDK, and multiple Linux distributions.
  • •  Comprehensive set of demo applications and tutorials to accelerate development of robotics applications.
  • •  Follows the design of the rest of RB series of products, it complaints with the 96Board, support for sensors such as multiple cameras, depth sensing solution, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range, multi-mic and additional sensors like IMU, pressure sensor, magnetometer etc.
  • •  Multiple interfaces and I/Os which can connect multiple sensors.


Applications


  • •  Automated Guided Vehicle
  • •  Consumption/Entertainment
  • •  Robot Drone
  • •  Industrial Control
  • •  Industrial Robot
  • •  Self-driving Vehicle for logistics
  • •  Service Robot


What’s Included


  • •  Development board based on the Qualcomm QCS6490 processor
  • •  12V wall power supply
  • •  USB Type-C cable
  • •  Mini speakers
  • •  Setup guide
  • •  Pick tool for setting switches


Component Qualcomm® RB3 Gen 2
SOM Platform
  • •  Qualcomm® QCS6490
  • •  Qualcomm® Kryo™ CPU 670
  • •  Qualcomm® Adreno™ GPU 642L, Adreno 633 VPU, Adreno DPU 1075
  • •  Qualcomm® Compute Hexagon™ DSP with dual HVX
  • •  Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator
  • •  Qualcomm® Spectra™ 570L image processing
Storage
  • •  128 GB UFS2.1 Onboard Storage
  • •  1 x MicroSD Card Slot
Ethernet
  • •  1 x 1GbE Ethernet
  • •  1 x 2.5GbE Ethernet
Wireless
  • •  Tri-band 2x2 MIMO DBS 802.11ax + Bluetooth 5.2 supports simultaneous operation on 2.4 GHz and 5 GHz or 6 GHz (DBS)
  • •  On-Board WLAN/BT Antennas
USB
  • •  1 x USB 2.0 Micro B (Debug only)
  • •  1 x USB 2.0 Micro B (OTG Mode)
  • •  1 x USB 3.0 Type C (ADB Mode, support DP out)
  • •  2 x USB 3.0 Type A (Host Mode Only)
Display
  • •  1 x HDMI 1.4 (Type A - full) on Board Connector
  • •  1 x eDP 1.4 (MINI DP) on Board Connector
  • •  1 x DP 1.4 (Type C - full) on Board Connector
Audio
  • •  2 x Class-D on Board Speaker Amplifier, WSA8835
  • •  2 x speaker connector on Board
  • •  1 x on Board PDM MIC on Mainboard
  • •  4 x on Board PDM MIC on NAV MEZZ (only support in Qualcomm® Robotics RB3 Gen 2 Vision Kit.)
Sensor Accelerometer + Gyro Sensor (TDK ICM-42688/ ICM-42688-P) Barometric Pressure
Camera Vision kit:
  • •  IMX577 l * (only support in Qualcomm® Robotics RB3 Gen 2 Vision Kit.)
  • •  OV9282 l * (only support in Qualcomm® Robotics RB3 Gen 2 Vision Kit.)
Accessories:
TBD
Expansion interfaces Expansion connectors:
  • •  HS1:1 x 60 pin high-speed connector (1 x QSPI, 1 x 4L MIPI DSI, 1 x USB 2.0, CCI I2C x2, 2L+4L-MIPI CSI)
  • •  HS2:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, SPI x 1, PCIe 3.0 gen3 1L, USB 3.0 x1, GPIO x 8 for RB3 Gen 2 Core Kit)
  • •  HS3:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, 4L-MIPI CSI x1(plus 2L CSI in HS1), RF CLK x 2, 2L-PCIe 3.0 x 1, 2L-PCIe 3.0 x 1(plus PCIe 1L in HS2), 4L-MIPI DSI x 1)
  • •  LS1:1 x 40 pin low-speed connector (UART x 1, SPI, I2S/PCM x 1, I2C x 2, GPIO x 12 for RB3 Gen 2 Core Kit, DC powers)
  • •  LS2:1 x 46 pin low-speed connector (Speaker x 2, DMIC I/F x 3, CAN, I2S, GPIO x 12 for RB3 Gen 2 Core Kit, PWM x 2, ADC x 2, CCI-I2C x 2, DC powers)
  • •  LS3:1 x 46 pin low-Speed connector (SPI x 2, SNS I2C x 1, sensor interrupt x 5, GPIO x 19 for RB3 Gen 2 Core Kit, RTC clock, DC powers)
LED 7 x LED Indicators 4 x User Controllable 2 x For radios (WLAN activity) 1 x Power indicator
Buttons
  • •  Power
  • •  Volume Up/Down
  • •  Force USB Boot
  • •  Dip Switch x 5 (6pin x 1+4pin x 3+2pin x 1) (only support in Qualcomm® Robotics RB3 Gen 2 Core Kit.)
  • •  Dip Switch x 7 (6pin x 3+4pin x 3+2pin x 1) (only support in Qualcomm® Robotics RB3 Gen 2 Vision Kit.)
Power source 12 V @2.5A adapter with a DC plug inner diameter 1.75mm and outer diameter 4.75mm
Size 85 mm x 54 mm meets the 96boards Hardware Specifications


Related Products

RB3G2 Vision Kit

Product Technical Specifications
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8471.50.01.50
  • Type
    Development Kit
  • Supported Device
    QCS6490
  • Supported Device Technology
    Application Processor and SOC
  • RAM Size
    6GB
  • Program Memory Size
    128GB
  • Program Memory Type
    Flash
  • USB
    5
  • I2C
    1
  • SPI
    1
  • UART
    1
  • GPIO
    0
  • Display Interface
    HDMI
  • Display Type
    LCD
  • Operating Systems
    Android|Linux
  • PC Card Interface
    micro SD
  • Main Program Memory Type
    Flash
  • Android
    Android
  • Linux
    Linux
  • Daughter Cards
    No

Documentation and Resources

Datasheets
Design resources