Product Technical Specifications
EU RoHS
Compliant with Exemption
ECCN (US)
EAR99
Part Status
Active
HTS
8541.29.00.55
SVHC
Yes
SVHC Exceeds Threshold
Yes
Automotive
Yes
PPAP
Unknown
Category
Power MOSFET
Configuration
Single Triple Source
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
1
Maximum Drain-Source Voltage (V)
25
Maximum Gate-Source Voltage (V)
20
Maximum Gate Threshold Voltage (V)
2.2
Operating Junction Temperature (°C)
-55 to 175
Maximum Continuous Drain Current (A)
230
Maximum Gate-Source Leakage Current (nA)
100
Maximum IDSS (uA)
1
Maximum Drain-Source Resistance (mOhm)
1.2@10V
Typical Gate Charge @ Vgs (nC)
28@4.5V|60.3@10V
Typical Gate Charge @ 10V (nC)
60.3
Typical Gate to Drain Charge (nC)
7
Typical Gate to Source Charge (nC)
10.4
Typical Reverse Recovery Charge (nC)
29.7
Typical Input Capacitance @ Vds (pF)
4327@12V
Typical Reverse Transfer Capacitance @ Vds (pF)
292@12V
Minimum Gate Threshold Voltage (V)
1.2
Typical Output Capacitance (pF)
1734
Maximum Power Dissipation (mW)
172000
Typical Fall Time (ns)
20.2
Typical Rise Time (ns)
30.3
Typical Turn-Off Delay Time (ns)
28.9
Typical Turn-On Delay Time (ns)
25.1
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
175
Packaging
Tape and Reel
Typical Drain-Source Resistance @ 25°C (mOhm)
1.03@10V|1.4@4.5V
Maximum Pulsed Drain Current @ TC=25°C (A)
1163
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
125
Typical Diode Forward Voltage (V)
0.8
Typical Gate Plateau Voltage (V)
2.7
Typical Reverse Recovery Time (ns)
33.5
Maximum Diode Forward Voltage (V)
1.2
Typical Gate Threshold Voltage (V)
1.73
Maximum Positive Gate-Source Voltage (V)
20
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
230
Mounting
Surface Mount
Package Height
1
Package Width
3.95
Package Length
4.9
PCB changed
4
Tab
Tab
Standard Package Name
FPAK
Supplier Package
LFPAK
Pin Count
5
Lead Shape
Gull-wing
Order Quantity