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OMAP3503ECBC|TI|simage
OMAP3503ECBC|TI|limage
Application Processors and SOCs

OMAP3503ECBC

SOC OMAP3 ARM Cortex A8 515-Pin POP-FCBGA Tray

Texas Instruments

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992.c
  • Part Status
    Obsolete
  • HTS
    COMPONENTS
  • Automotive
    No
  • PPAP
    No
  • Family Name
    OMAP3
  • Device Core
    ARM Cortex A8
  • Maximum Clock Rate (MHz)
    600
  • Program Memory Type
    ROM
  • Data Bus Width (bit)
    32
  • Program Memory Size
    112KB
  • RAM Size
    64KB
  • Type
    Applications Processor
  • Processing Unit
    Microprocessor
  • Watchdog
    2
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    90
  • Interface Type
    I2C/SPI/UART/USB
  • SPI
    4
  • I2C
    3
  • I2S
    0
  • UART
    3
  • Data Cache Size
    16KB
  • USB
    4
  • Instruction Cache Size
    16KB
  • USART
    0
  • CAN
    0
  • PCI
    0
  • Ethernet
    0
  • Programmability
    Yes
  • Core Architecture
    ARM
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.72(Max)
  • Package Width
    14.1(Max)
  • Package Length
    14.1(Max)
  • PCB changed
    515
  • Standard Package Name
    BGA
  • Supplier Package
    POP-FCBGA
  • Pin Count
    515
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources