Flash

MX66U2G45GXRI00

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 2G-bit 2G/1G/512M x 1/2-bit/4-bit 6.5ns 24-Pin CSP-BGA

Macronix International Co., Ltd.

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  2G

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Location of Boot Block

  Bottom|Top

• Address Width (bit)

  32

• Sector Size

  4Kbyte x 65536

• Page Size

  256byte

• Number of Bits/Word (bit)

  1/2/4

• Number of Words

  2G/1G/512M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  6.5

• Maximum Erase Time (s)

  300/Chip

• Maximum Programming Time (ms)

  1.5/Page

• Process Technology

  55nm

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Maximum Operating Frequency (MHz)

  133

• Minimum Operating Supply Voltage (V)

  1.65

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  2

• Programming Voltage (V)

  1.65 to 2

• Operating Current (mA)

  125

• Program Current (mA)

  40

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000(Typ)

• Mounting

  Surface Mount

• Package Height

  0.85

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  CSP-BGA

• Pin Count

  24

• Lead Shape

  Ball