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MX30UF4G18ABXKITR|MACRONIX|simage
MX30UF4G18ABXKITR|MACRONIX|limage
Flash

MX30UF4G18AB-XKI TR

SLC NAND Flash Parallel 1.8V 4G-bit 512M x 8 63-Pin VFBGA

Macronix International Co., Ltd.
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Part Status
    NRND
  • HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    SLC NAND
  • Chip Density (bit)
    4G
  • Architecture
    Non Sectored
  • Boot Block
    No
  • Address Width (bit)
    30
  • Page Size
    2Kbyte
  • Number of Bits/Word (bit)
    8
  • Number of Words
    512M
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Maximum Erase Time (s)
    0.0035/Block
  • Maximum Programming Time (ms)
    0.6/Page
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    1.7
  • Typical Operating Supply Voltage (V)
    1.8
  • Maximum Operating Supply Voltage (V)
    1.95
  • Operating Current (mA)
    30
  • Program Current (mA)
    30
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    Yes
  • Support of Page Mode
    Yes
  • Minimum Endurance (Cycles)
    100000(Typ)
  • Mounting
    Surface Mount
  • Package Height
    0.55(Min)
  • Package Width
    9
  • Package Length
    11
  • PCB changed
    63
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    63
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources