Flash
MX30UF4G18AB-XKI TR
SLC NAND Flash Parallel 1.8V 4G-bit 512M x 8 63-Pin VFBGA
Macronix International Co., Ltd.Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
3A991.b.1.a
Part Status
NRND
HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
SLC NAND
Chip Density (bit)
4G
Architecture
Non Sectored
Boot Block
No
Address Width (bit)
30
Page Size
2Kbyte
Number of Bits/Word (bit)
8
Number of Words
512M
Programmability
Yes
Timing Type
Asynchronous
Maximum Erase Time (s)
0.0035/Block
Maximum Programming Time (ms)
0.6/Page
Interface Type
Parallel
Minimum Operating Supply Voltage (V)
1.7
Typical Operating Supply Voltage (V)
1.8
Maximum Operating Supply Voltage (V)
1.95
Operating Current (mA)
30
Program Current (mA)
30
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Command Compatible
Yes
ECC Support
Yes
Support of Page Mode
Yes
Minimum Endurance (Cycles)
100000(Typ)
Mounting
Surface Mount
Package Height
0.55(Min)
Package Width
9
Package Length
11
PCB changed
63
Standard Package Name
BGA
Supplier Package
VFBGA
Pin Count
63
Lead Shape
Ball

